Temperature-homogenizing device

Heat exchange – Heat transmitter

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07066244

ABSTRACT:
A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

REFERENCES:
patent: 4524757 (1985-06-01), Buckley
patent: 4563375 (1986-01-01), Ulrich
patent: 4580619 (1986-04-01), Aitken
patent: 4646815 (1987-03-01), Iwata et al.
patent: 4997032 (1991-03-01), Danielson et al.
patent: 5205348 (1993-04-01), Tousignant et al.
patent: 5685363 (1997-11-01), Orihira et al.
patent: 6241005 (2001-06-01), Risca
patent: 2004/0118551 (2004-06-01), Czubarow et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Temperature-homogenizing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Temperature-homogenizing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temperature-homogenizing device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3650992

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.