Temperature equalizing element for a conduction cooling module

Details Temperature equalizing element for a conduction cooling module Temperature equalizing element for a conduction cooling module

1977-06-30

1979-05-08

Richter, Sheldon J.

Heat exchange

Heat transmitter

357 81, 357 82, F28F 700

Patent

active

041531078

ABSTRACT:
A thermal conduction element having a predetermined diminished diameter portion of a predetermined length along the length of the thermal conduction element is provided within each of the housing member openings located opposite the low-power components in a conduction cooling module. The thermal conduction elements and housing form part of a heat transfer path for removing heat from electronic components to be cooled. The thermal conduction elements and the interfaces associated therewith provide an increased thermal resistance, thereby, increasing the heat transfer path thermal resistance to prevent the low-power electronic components from being cooled below the lower temperature limit and allowing them to operate at a higher temperature.

REFERENCES:
patent: 3536892 (1970-10-01), Walther et al.
patent: 3545535 (1968-10-01), Hinkens
patent: 3993123 (1976-11-01), Chu et al.

Affiliated with

Also associated with

Rating

Temperature equalizing element for a conduction cooling module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Temperature equalizing element for a conduction cooling module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Temperature equalizing element for a conduction cooling module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1229557