Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-08-14
2007-08-14
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S070000
Reexamination Certificate
active
11521158
ABSTRACT:
A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
REFERENCES:
patent: 4022519 (1977-05-01), Hill
patent: 4813807 (1989-03-01), Mead
patent: 5572141 (1996-11-01), Hutton
patent: 6583354 (2003-06-01), Alcoe
patent: 7137826 (2006-11-01), Brodsky et al.
Brodsky William L.
Busby James A.
Chamberlin Bruce J.
Ferrill Mitchell G.
Susko Robin A.
Blecker, Esq. Ira
Nguyen Khiem
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