Temperature-controlled thermal platform for automated testing

Details Temperature-controlled thermal platform for automated testing Temperature-controlled thermal platform for automated testing

2005-03-15

2005-03-15

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C165S253000

Reexamination Certificate

active

06867611

ABSTRACT:
A temperature-controlled system and method for supporting a wafer or packaged integrated circuit (IC) under test are described. The system includes a thermal platform having a top surface assembly on which the wafer or IC can be mounted. A thermal plate is located under and in thermal communication with the top surface assembly. The thermal plate is made of a porous thermally conductive material. A temperature-controlled fluid such as air enters and propagates radially through the porous material of the thermal plate. The temperature of the wafer or IC is controlled by controlling the temperature of the air passing through the thermal plate. The plate can be made of a sintered metal such as copper or a reticulated foam or a carbon or graphite foam.

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