Temperature controlled substrate for VLSI construction having mi

Details Temperature controlled substrate for VLSI construction having mi Temperature controlled substrate for VLSI construction having mi

1996-05-10

1998-08-25

Paschall, Mark H.

Electric heating

Heating devices

With power supply and voltage or current regulation or...

219501, 219209, 219508, 307141, 257291, 257547, H05B 102

Patent

active

057985022

ABSTRACT:
A closed loop control system for controlling the temperature of a heated substrate is presented. In the preferred embodiment, the closed loop control system is implemented substantially or completely on a single substrate. The closed loop control system comprises means to reduce or eliminate parasitic feedback in the control system. In one aspect of the present invention, the mechanism for reducing the effects of parasitic feedback comprises a mechanism to prevent minority carriers from collecting around the base of the temperature sensing device. The mechanism for preventing minority carriers from collecting around the base of the temperature sensing device can be one or more guard rings which attract the minority carriers and prevent them from collecting around the base of the temperature sensor. In another aspect of the present invention, the mechanism for reducing the effects of parasitic feedback can be a sample and hold circuit which approximates the theoretically ideal sample and hold circuit in order to present a substantially open circuit to the parasitic feedback.

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