Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1981-08-13
1983-07-26
James, Andrew J.
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
65 32, 165 80R, 16510426, 357 74, H01L 2504, H01L 2302, H01L 2312
Patent
active
043957285
ABSTRACT:
A temperature controlled apparatus has a heat-sensitive device chip having its top and bottom major surfaces in direct thermal contact with, respectively, a metal disk and a heat-sinking substrate. A resilient sheet surrounds the chip to form a first gas-tight enclosure between the metal disk and the substrate. A rigid can encloses the assembly and contains an evaporatable liquid to complete the package. When power is applied and dissipated, the chip and metal disk get hot, heating the liquid to increase its vapor pressure, generally logarithmically, inside the can and pressurizing the metal disk. Because of the very large areal ratio between the metal disk and the chip, a pressure is induced on the chip which is greatly magnified, according to the areal ratio, from the vapor pressure.
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