Temperature control system for semiconductor wafer or substrate

Details Temperature control system for semiconductor wafer or substrate Temperature control system for semiconductor wafer or substrate

1991-04-05

1992-05-19

Flanigan, Allen J.

Heat exchange

Heating and cooling

Heating and cooling of the same material

165 801, 165 805, 118725, F25B 2900

Patent

active

051139294

ABSTRACT:
A temperature control system is used in conjunction with sputtering, CDV, etching, and the like apparatuses for processing a substrate on which semiconductor devices are integrated. This system responds quickly to any change in the temperature of the substrate being processed, by heating or cooling the substrate to an appropriate temperature and maintaining it constant at such temperature. The heating is accomplished by radiant heaters which heat a gas flowing through the apparatus, which in turn transfers heat to the substrate mounted on the apparatus.

REFERENCES:
patent: 4282924 (1981-08-01), Faretra
patent: 4508161 (1985-04-01), Holden
patent: 4527620 (1985-07-01), Pedersen et al.
patent: 4535834 (1985-08-01), Turner
patent: 4609037 (1986-09-01), Wheeler et al.
patent: 4671204 (1987-06-01), Ballou

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