Temperature control of solid state circuit chips

Electric heating – Heating devices – Combined with diverse-type art device

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219499, H05B 102

Patent

active

044814038

ABSTRACT:
Controlled heater apparatus for selectively heating a solid state circuit chip and the substrate upon which it is mounted by a solder bump so as to cause substantially equal expansion and contraction in the chip and substrate to relieve stress on the connecting solder bump.

REFERENCES:
patent: 2787750 (1957-04-01), Jones
patent: 3887785 (1975-06-01), Ahlport
patent: 4374316 (1983-02-01), Inamori
patent: 4385310 (1983-05-01), Houston
patent: 4413308 (1983-11-01), Brown
patent: 4417296 (1983-11-01), Schelhorn
Greenhouse, Harold M., "Design of Temperature-Controlled Substrates . . .", Microelectronics, vol. 6, No. 1, Sep. 1974.

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