Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1999-07-14
2002-12-03
Sherry, Michael (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S761010, C324S754090
Reexamination Certificate
active
06489793
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates in general to the field of temperature control and more particularly to an improved apparatus and method of providing temperature control to electronic devices using power following feedback.
2. Description of Related Art
The present invention relates to temperature control systems which maintain the temperature of an electronic device at or near a constant set point temperature while the device is being operated or tested. Two examples of electronic devices which are best operated at a constant or near constant temperature are packaged integrated chips and bare chips which are unpackaged. Maintaining the chip temperature near a constant set point is not difficult if the power dissipation of the chip is constant or varies in a small range while operating or testing. One way of handling such a situation is to couple the chip through a fixed thermal resistance to a thermal mass which is at a fixed temperature. But if the instantaneous power dissipation of the chip varies up and down in a wide range while operating or testing, then maintaining the chip temperature near a constant set point is very difficult.
Various temperature forcing systems are used to respond to the chip's temperature variation caused by widely varying power dissipation of the chip. Feedback methods are commonly used to sense the varying temperature. Typical approaches involve the use of a temperature sensing device such as a thermocouple, mounted on the chip package or chip itself. Another approach is to integrate a temperature sensing device, such as a thermal diode, into the chip circuitry. Such a temperature sensing device would be used to sense changes in the chip's temperature, and then adjust the temperature forcing system appropriately.
There are several problems with the use of temperature sensing devices. In the case of packaged chips, an externally mounted thermocouple will indicate the temperature of the package surface, not the temperature of the chip inside the package. At some level of power dissipation, this temperature difference will be significant to the test result. The use of temperature sensors integrated into the chip itself addresses this problem, but raises other issues. It is not typical practice for the chip manufacturer to integrate temperature sensors on the chip. Even if it were, each chip's temperature sensor would have unique calibration requirements. All of the above present problems for high volume chip manufacturing.
Temporary temperature sensors, such as thermocouple probes, included in automated test handling equipment can address some of these issues. However, the package temperature vs. die temperature problem will remain. Also, the reliability of the temporary temperature sensor introduces error which can be significant to the high volume chip manufacturing test result. Moreover, the surface available for temperature control is the same surface needed for the temporary temperature sensor, complicating the problem further.
Therefore, a need has arisen for an apparatus and method of temperature control for electronic devices which can respond to the temperature of the electronic device, instead of the package. A further need exists for an apparatus and method of temperature control for electronic devices which can conveniently be used for high volume chip manufacturing. A further need exists for an apparatus and method of temperature control for electronic devices which is reliable. A further need exists for an apparatus and method of temperature control for electronic device which does not require significant surface area of the electronic device. A further need exists for a method of temperature control for electronic devices which does not require temperature sensing devices to be integrated into the chip or to be temporarily in contact with the chip. A further need exists for a method of temperature control for electronic devices which does not require collecting, maintaining, and applying the use of chip power profiles, and does not require the capability of performing such tasks in the automated test equipment, temperature forcing system, and testing software.
The present invention is directed to overcoming or at least reducing the effects of one or more of the problems set out above.
SUMMARY OF THE INVENTION
In accordance with the present invention, an apparatus and method of temperature control for electronic devices is provided that substantially eliminates or reduces the disadvantages and problems associated with the previously developed temperature control for electronic devices.
An advantage of the present invention is that it provides an apparatus and method of temperature control for electronic devices which can respond to the temperature of an electronic device, instead of the package.
Another advantage of the present invention is that it provides an apparatus and method of temperature control for electronic devices which can conveniently be used for high volume chip manufacturing.
A further benefit of the present invention is that it provides an apparatus and method of temperature control for electronic devices which is reliable.
Yet another advantage of the present invention is that it provides an apparatus and method of temperature control for electronic devices which does not require significant surface area of an electronic device for temporary monitoring of package temperature.
Another benefit of the present invention is that it eliminates the need for temperature sensing devices to be integrated into the chip or to be temporarily connected to the chip for temperature control in high volume manufacturing.
Yet another benefit of the present invention is that it eliminates the need to collect, maintain, and apply the use of chip power profiles, as well as eliminating the need for the capability in the automated test equipment, temperature forcing system, and testing software to collect and apply chip power profiles.
Briefly, in accordance with one aspect of the present invention, there is provided a method for controlling a temperature of a device. The method includes measuring a parameter related to power consumption by the device and utilizing the measured parameter in controlling the temperature of the device. The measuring of the parameter and the controlling of the temperature occur contemporaneously. The parameter is other than the temperature of the device, and the relevant power consumption is the power which is consumed by the device through power connections as opposed to signal connections.
Briefly, in accordance with another aspect of the present invention, there is provided a method for calculating a real time temperature of a device. The method includes measuring a real time power usage of the device, and using the measured real time power usage of the device in determining a figure which can be used for the real time temperature of the device. The power usage relates to power which is used by the device through one or more power connections as opposed to signal connections.
Briefly, in accordance with another aspect of the present invention, there is provided a method for controlling a temperature of a device in a system containing a temperature forcing system coupled to the device. The method includes monitoring a power consumption of the device, adjusting a temperature of the temperature forcing system based in part on the monitored power consumption of the device, and controlling the device temperature with the temperature forcing system. The power consumption relates to power which is supplied to the device by one or more power supplies.
Briefly, in accordance with another aspect of the present invention, there is provided a system for controlling a temperature of a device. The system includes a measuring device for measuring a parameter related to power consumption by the device, a heat exchanger adapted to be coupled to the device, and a thermal controller for determining a setting of the heat exchanger. The setting is determined in part by
Jones Thomas P.
Malinoski Mark F.
Turner Jonathan E.
Delta Design, Inc.
Hollington Jermele
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