Temperature control for wafer polishing

Details Temperature control for wafer polishing Temperature control for wafer polishing

1981-09-04

1984-05-29

Whitehead, Harold D.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

5116573, 51322, 51356, B24B 704

Patent

active

044506520

ABSTRACT:
A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.

REFERENCES:
patent: 2869294 (1959-01-01), Boettcher
patent: 3571978 (1971-03-01), Day
patent: 3916573 (1975-11-01), Elbe
patent: 4001980 (1977-01-01), Wallin
patent: 4313284 (1982-02-01), Walsh

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