Temperature control for high power burn-in for integrated circui

Details Temperature control for high power burn-in for integrated circui Temperature control for high power burn-in for integrated circui

1997-01-13

1999-06-15

Paschall, Mark H.

Electric heating

Heating devices

With power supply and voltage or current regulation or...

219209, 219494, 324755, 324760, H05B 102

Patent

active

059118970

ABSTRACT:
A temperature control system for high power burn-in of integrated circuit chips which includes an individual heat sink at each of the integrated circuit chips to dissipate heat generated by the integrated circuit. A heater for each chip is provided and is temperature controlled so that heat may be added by the heater as a function of the heat generated by the integrated circuit chip. A temperature sensor is provided in close thermal contact with the integrated circuit chip to sense the temperature of the integrated circuit chip. A closed loop temperature controller is used to vary the amount of current provided to the heater to maintain a desired range of temperature. Thermal contact between the temperature sensor and the integrated circuit chips is insured by utilizing a spring to urge the sensor toward the integrated circuit chip.

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patent: 5682064 (1997-10-01), Atkins et al.
patent: 5705933 (1998-01-01), Lim et al.

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