Temperature control carrier head for chemical mechanical polishi

Details Temperature control carrier head for chemical mechanical polishi Temperature control carrier head for chemical mechanical polishi

1999-05-17

2000-06-20

Morgan, Eileen P.

Abrading

Abrading process

With critical temperature modification or control of work or...

451 41, 451398, 451287, B24B 4900

Patent

active

060771518

ABSTRACT:
The temperature of a wafer is controlled during a chemical mechanical polishing process. Fluid containment is provided on a wafer backing plate in contact with the wafer during the chemical mechanical polishing process. Transportation of fluid is provided to and from the fluid containment during the chemical mechanical polishing process. Temperature of the fluid is controlled in order to control temperature on the wafer during the chemical mechanical polishing process.

REFERENCES:
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5797789 (1998-08-01), Tanaka et al.
patent: 5873769 (1999-02-01), Chiou et al.

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