Temperature conditioning support for small objects such as semi-

Details Temperature conditioning support for small objects such as semi- Temperature conditioning support for small objects such as semi-

1989-04-28

1991-07-23

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

165 804, 324158P, 361385, G01R 3102, F28F 700

Patent

active

050346881

ABSTRACT:
The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of a platen and a hollow base. Inside the hollow cavity is contained a serpentine which can convey thermal fluid capable of heating and/or cooling the platen to achieve temperature regulation of the object placed on the platen, according to data supplied by a thermometric system that includes a temperature sensor associated to said support. The platen is made of electrically insulating and thermally conducting ceramic, the base being made of a material whose thermal expansion coefficient is substantially equal to that of the platen. A thin-film electrical resistance can be provided to ensure heating and, optionally, temperature measurement of the platen.

REFERENCES:
patent: 3455376 (1969-07-01), Beurtheret
patent: 3710251 (1973-01-01), Hagge et al.
patent: 4862075 (1989-08-01), Choi et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 12, May 1977, pp. 4688-4689, New York, US; V. W. Antonetti et al.: "Air Jet Spot Cooling".
Patent Abstracts of Japan, vol. 7, No. 150 (P-207) (1295), Jun. 30, 1983; & JP.gtoreq.A-58 60 269 (Meidensha K.K.) 09-04-83.
IEEE Transactions on Industry Applications, vol. IA-13, No. 3, May/Jun. 1977, pp. 254-259; S. B. Sample et al.: "Reliability Testing of Triacs".
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, pp. 1440-1441, New York, US; V. Y. Doo et al.: "Semiconductor Chip Cooling Package".

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