Temperature compensation method for semiconductor wafers in rapi

Details Temperature compensation method for semiconductor wafers in rapi Temperature compensation method for semiconductor wafers in rapi

1997-07-08

1999-07-20

Walberg, Teresa

Electric resistance heating devices

Heating devices

Radiant heater

219405, 219411, 118724, 118728, 118730, F26B 330, A21B 100, A01K 1504

Patent

active

059266155

ABSTRACT:
The "Temperature compensation method for semiconductor wafers in rapid thermal processor using properly designed heat conducting pads as susceptors" is a new temperature compensation concept suitable for rapid thermal processor without uniform temperature distributions. By proper design of heat conducting pads, one can make the semiconductor wafers have uniform temperature distribution in a non-uniform heated rapid thermal processor. This is a very simple and cheap method for solving the temperature non-uniformity problem in the rapid thermal processor.

REFERENCES:
patent: 5444217 (1995-08-01), Moore
patent: 5517594 (1996-05-01), Shah
patent: 5715361 (1998-02-01), Moslehi

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