Semiconductor device manufacturing: process – Making passive device – Resistor
Reexamination Certificate
2007-08-07
2007-08-07
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Making passive device
Resistor
C257S536000, C257SE21004, C338S009000
Reexamination Certificate
active
10982009
ABSTRACT:
A method for forming a temperature-compensated resistor on a semiconductor substrate is provided. A resistor element is formed on the semiconductor substrate. Terminal contacts are formed on the ends of the resistor element. A temperature-compensating configuration is formed, and is selected from an enlarged transverse portion in the resistor element intermediate and spaced from the terminal contacts, and at least one contact pattern along and in contact with the resistor element intermediate and spaced from the terminal contacts.
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Avago Technologies Wireless IP (Singapore) Pte. Ltd.
Baumeister B. William
Fulk Steven J.
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