Oscillators – With outer casing or housing
Reexamination Certificate
2007-08-14
2007-08-14
Chang, Joseph (Department: 2817)
Oscillators
With outer casing or housing
C331S10800D, C331S158000, C310S348000, C310S344000
Reexamination Certificate
active
11293870
ABSTRACT:
A temperature compensated crystal oscillator has a package body, a crystal blank hermetically sealed in a first recess of the package body, and an IC chip which includes an oscillation circuit electrically connected to the crystal blank, and a temperature compensating mechanism for compensating the crystal blank for the frequency-temperature characteristic. The oscillation circuit and temperature compensating mechanism are integrated into the IC chip. The IC chip is received in a second recess of the package body such that a circuit formation surface thereof faces the bottom face of the package body. External write terminals are formed on a principal surface of the IC chip, which is not the circuit formation surface, for writing temperature compensation data into the temperature compensating mechanism.
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patent: 5500628 (1996-03-01), Knecht
patent: 6456168 (2002-09-01), Luff
patent: 6759913 (2004-07-01), Biernacki
patent: 2003/0001682 (2003-01-01), Biernacki
patent: 2004/0135645 (2004-07-01), Koyama et al.
patent: 2006/0055478 (2006-03-01), Isimaru
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patent: 2001-036343 (2001-02-01), None
patent: 2002-190710 (2002-07-01), None
Mizumura Hiroaki
Yamazaki Akio
Chang Joseph
Muirhead and Saturnelli LLC
Nihon Dempa Kogyo Co. Ltd.
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