Temperature and pressure control methods to fill features...

Details Temperature and pressure control methods to fill features... Temperature and pressure control methods to fill features...

2011-08-09

2011-08-09

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S627000, C438S632000, C438S643000, C438S653000, C438S660000, C257SE21303, C257SE21588

Reexamination Certificate

active

07994034

ABSTRACT:
A programmable resistance, chalcogenide, switching or phase-change material device includes a substrate with a plurality of stacked layers including a conducting bottom electrode layer, an insulative layer having an opening formed therein, an active material layer deposited over both the insulative layer, within the opening, and over selected portions of the bottom electrode, and a top electrode layer deposited over the active material layer. The device uses temperature and pressure control methods to increase surface mobility in an active material layer, thus providing complete coverage or fill of the openings in the insulative layer, selected exposed portions of the bottom electrode layer, and the insulative layer.

REFERENCES:
patent: 5731245 (1998-03-01), Joshi et al.
patent: 6114098 (2000-09-01), Appelt et al.
patent: 2006/0024429 (2006-02-01), Horii

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