Telescoping thermal conduction element for semiconductor devices

Heat exchange – With retainer for removable article – Including liquid heat exchange medium

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174 16HS, 357 79, 357 81, 361386, H01L 2340

Patent

active

044833890

ABSTRACT:
A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

REFERENCES:
patent: 2905742 (1959-09-01), Woods
patent: 2973400 (1961-02-01), McAdam
patent: 3106601 (1963-10-01), Hamm
patent: 3249680 (1964-04-01), Sheets et al.
patent: 4246597 (1981-01-01), Cole et al.
patent: 4295152 (1981-10-01), Khoe et al.
IBM TDB, vol. 20, No. 6, Nov. 1977, p. 2829.
IBM TDB, vol. 19, No. 12, May 1977, p. 4622.

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