Telescoping thermal conduction element for cooling semiconductor

Details Telescoping thermal conduction element for cooling semiconductor Telescoping thermal conduction element for cooling semiconductor

1982-12-20

1984-05-15

Cline, William R.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

165185, F28F 700

Patent

active

044482400

ABSTRACT:
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cap located in close proximity to the device having a first plate to be placed in contact with a semiconductor device surface, a first spiral strip of heat conductive material joined to the first plate, a second plate to be placed in contact with a heat sink surface or cap spaced from the device surface, and a second spiral strip of thin heat conductive material interleaved with the first spiral strip and in partially overlapping telescoping relation, the second spiral strip joined to the second plate, and a means to bias the first and second plate outwardly relative to each other.

REFERENCES:
patent: 1129704 (1915-02-01), Merie
patent: 3844341 (1974-10-01), Bimshas
patent: 3993123 (1976-11-01), Chu et al.
patent: 4034468 (1977-07-01), Koopman
patent: 4081825 (1978-03-01), Koopman
patent: 4156458 (1979-05-01), Chu et al.

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