Telescoping blind via in three-layer core

Details Telescoping blind via in three-layer core Telescoping blind via in three-layer core

2008-07-22

2008-07-22

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000, C029S03300H, C029S650000, C029S738000, C029S846000, C029S849000

Reexamination Certificate

active

10683641

ABSTRACT:
A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer, an internal bridge layer, a second dielectric layer, and a second metal layer. The bridge layer includes a plurality of bridge pads. Each carrier includes a plurality of interlayer interconnection units for interconnecting the first and second metal layers. Each interlayer interconnection unit comprises a pair of opposed blind vias and a bridge pad disposed between, and in electrical contact with, the pair of blind vias.

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