Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Patent
1986-08-29
1987-09-22
Weidenfeld, Gil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
333184, 439607, 439676, H01R 1366
Patent
active
046951156
ABSTRACT:
A modular jack for telephones in which bypass capacitors have been connected to the leads so as to bypass noise and other high frequency signals. End mounted ceramic capacitors extend from the leads to a ground plane which is provided with flexible fingers and which is connected to a suitable ground so as to provide a grounding contact for the capacitors.
REFERENCES:
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patent: 3761869 (1973-09-01), Hardesty et al.
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patent: 4054350 (1977-10-01), Hardesty
patent: 4538874 (1985-09-01), Dambach et al.
patent: 4572600 (1986-02-01), Nieman
patent: 4580866 (1986-04-01), Hagner
patent: 4582385 (1986-04-01), Couper et al.
patent: 4600256 (1986-07-01), Anttila
Corcom Inc.
Paumen Gary F.
Weidenfeld Gil
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