Teflon filled resinoid dicing blades for fabricating silicon die

Details Teflon filled resinoid dicing blades for fabricating silicon die Teflon filled resinoid dicing blades for fabricating silicon die

1994-11-07

1996-02-27

Utech, Benjamin

Coating processes

Vacuum utilized prior to or during coating

Metal base

427358, 427435, B05D 300

Patent

active

054946980

ABSTRACT:
A resinoid dicing blade having approximately a 20% by volume porosity structure is coated and impregnated with Teflon.RTM. by a process which impregnates the resinoid blade with Teflon.RTM. to about 0.3 to 0.5% by weight. The Teflon.RTM. impregnated dicing blades not only reduces nozzle chipping when bonded silicon wafers are separated into a plurality of individual printhead die, but blade life is significantly increased.

REFERENCES:
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patent: 4729905 (1988-03-01), Zhed et al.
patent: 4878992 (1989-11-01), Campanelli
patent: 5288521 (1994-02-01), Maldaner
patent: 5306370 (1994-04-01), Herko et al.

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