Techniques for via formation and filling

Details Techniques for via formation and filling Techniques for via formation and filling

1991-08-26

1995-11-28

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257758, 257774, 257775, H01L 2348

Patent

active

054710910

ABSTRACT:
Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush with the topmost insulating layer. The pillars are provided under every feature over which a via will be formed, so that an insulating layer surrounding the via will be thinner at the location of the feature. If necessary, polishing is continued to thin the insulating layer so that the plugs in initially selectively under-filled vias are made flush with the insulating layer. Method and apparatus are disclosed.

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Thin Film Processes, by Vossen et al., pp. 497-521, 1978.

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