Techniques for treating a surface crack on a component

Details Techniques for treating a surface crack on a component Techniques for treating a surface crack on a component

2007-05-01

2007-05-01

Shaw, Clifford C. (Department: 1725)

Electric heating

Metal heating

Methods

C219S050000

Reexamination Certificate

active

11022999

ABSTRACT:
A system is configured to treat a conductive component. The system includes a power source, an interface configured to electrically contact with a surface of the conductive component, and a controller coupled to the power source and the interface. The controller is configured to pass electric current (e.g., electric pulses) from the power source through the interface and the component to melt tips of a set of cracks along the surface of the component. As the current passes around the set of cracks, the current generates localized heating in high-resistance dislocations at the crack tips to repair the cracks. Accordingly, such current heals the cracks and inhibits the cracks from spreading. Furthermore, the effect of the current remains localized thus enabling the current to strengthen the material around the cracks while easily avoiding damaging or weakening other portions of the component.

REFERENCES:
patent: 531197 (1894-12-01), Lemp
patent: 4307280 (1981-12-01), Ecer
patent: 6489584 (2002-12-01), Kelly
Nader G. Dariavach, “The Effect of High Density Electric Pulses on Sintered Aluminum 201AB SiC MMC PM Compacts During Plastic Deformation”, Oct. 2002, pp. 1-176.
Nader G. Dariavach and James A. Rice, “Electromigration and the Electroplastic Effect in Aluminum SiC MMCs”, May 2000, pp. 40-42.

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