Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2000-11-28
2004-02-03
Deb, Anjan K. (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S076630, C714S726000
Reexamination Certificate
active
06686759
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The field of the present invention generally relates to electronic design automation and testing of integrated circuits, and, more particularly, to methods and systems for testing embedded cores in complex, multi-core integrated circuit designs.
2. Background
Chip designers often use electronic design automation (EDA) software tools to assist in the design process, and to allow simulation of a chip design prior to prototyping or production. Chip design using EDA software tools generally involves an iterative process whereby the chip design is gradually perfected. Typically, the chip designer builds up a circuit by inputting information at a computer workstation generally having high quality graphics capability so as to display portions of the circuit design as needed. A top-down design methodology is commonly employed using hardware description languages (HDLs), such as Verilog® or VHDL, for example, by which the designer creates an integrated circuit by hierarchically defining functional components of the circuit, and then decomposing each component into smaller and smaller components.
The various components of an integrated circuit are initially defined by their functional operations and relevant inputs and outputs. From the HDL or other high level description, the actual logic cell implementation is typically determined by logic synthesis, which converts the functional description of the circuit into a specific circuit implementation. The logic cells are then “placed” (i.e., given specific coordinate locations in the circuit layout) and “routed” (i.e., wired or connected together according to the designer's circuit definitions) using specialized placement and routing software, resulting in a physical layout file. A mask file, for example a GDSII or CIF format, may be provided to a foundry, and contains enough information to allow the foundry to manufacture an actual integrated circuit therefrom.
At various stages of the design process, validation of the design may be desired through test or verification procedures. To test a design, a set of test vectors is ordinarily generated which will be applied to the inputs to the design and compared against the outputs of the design. An error in the design will be indicated if the actual output generated by the design does not match the expected output. A test access port (TAP) is usually provided on-chip for receiving input test data from a test data source and outputting output test data from the integrated circuit. The test access port is generally used for testing an integrated circuit during and after the manufacturing of the integrated circuit. Another common use of the test access port is on a printed circuit board (PCB) where interconnectivity between multiple components (ICs) can be verified in addition to testing the individual components (ICs). The test access port is generally connected to a serially linked set of boundary-scan cells, one such cell for each input and output pin of the integrated circuit. The test access port controls the inflow and outflow of information with respect to the boundary-scan cells, and hence with respect to the integrated circuit core.
Test and verification processes are facing new challenges due to changes in integrated circuit (IC) design. In particular, decreases in the feature size of circuit elements has led to the ability to place more components on a single integrated circuit. At the same time, decreases in design cycle time are being sought, in order to allow faster time-to-market and hence a potential competitive advantage. Due in part to these trends, the current trend in integrated circuit core design is to create more and more complex cores capable of being stored on a single IC. Design cores that were previously whole ICs have now been reduced to sizes allowing their use as individual components of complex ICs containing multiple design cores.
Another trend in the integrated circuit design industry is to reuse pre-existing circuit blocks in a new design, particularly in multi-core integrated circuits, in order to reduce the development time of an integrated circuit. The pre-existing circuit blocks may be “soft” or “hard”, or somewhere in between. A “soft” circuit block is one that has not been physically laid out, while a “hard” circuit block has its physical layout already determined (i.e., placement and routing of its internal components has been achieved). Pre-existing circuit blocks may occasionally be referred to as “VCs” (short for “Virtual Components”) or “IPs” (short for “Intellectual Properties,” suggesting their proprietary nature to particular designers). Often, pre-existing circuit blocks will include their own individual test access port to allow testing of the IP itself, assuming the test access port is accessible through chip-level pins after the pre-existing circuit block is placed in a larger integrated circuit design.
The state-of-the-art approach to complex IC design involves system development using pre-existing circuit cores (e.g., VCs or IPs) which have already been individually tested using manufacturer developed test vectors. Often, a basic IC platform is developed, and as the design functionality is expanded more pre-existing circuit cores are added to the hierarchy of the design. Reuse of pre-existing integrated circuit cores generally raises the possibility of using the existing manufacturing level test vectors to further reduce total design and verification time. Investing time in developing new test vectors when test vectors already exist for a given virtual component block would defeat the goal of reducing the time-to-market through partial design reuse. This is particularly true if the reused virtual component block is already hardened, leaving little or no room to generate different test vectors.
As the design size and complexity of integrated circuits has increased, the time necessary to develop manufacturing level test vectors has also increased significantly, causing increased delays in delivering the chips to market. To complicate matters further, the widely accepted IC test standard, Standard 1149.1 promulgated by the Institute of Electrical and Electronics Engineers (IEEE), cannot be used directly in ICs containing embedded cores with built-in test access ports. The 1149.1 standard was formulated with the goal of allowing one test access port per chip, and does not take into account the possibility of chip designs containing multiple embedded cores, some of which may already have built-in 1149.1 compliant test access ports. This problem is becoming increasingly significant as the 1149.1 test standard has reached widespread acceptance in the electronics and semiconductor industries, making it highly desirable that current and future ICs be fully compliant with the standard.
Use of existing or even new test vectors to test the individual cores inside multi-core integrated circuits poses difficult challenges because the individual cores are embedded within the chip, with limited or no direct pin access exterior to the chip itself. When the multi-core integrated circuits are manufactured, only necessary external connectivity is maintained; therefore, many of the pins of the of the individual circuit blocks are partially or completely inaccessible from outside the chip. Because external connectivity to each pin of the individual circuit blocks cannot be provided, testing individual circuit blocks by applying a set of test vectors to the manufactured multi-core integrated circuit designs can be problematic. Further, even if the circuit blocks have boundary-scan (BS) ports, and even if the test vectors are designed to test the individual circuit blocks through their boundary-scan ports, it is neither feasible nor efficient to bring the connectivity of the entire boundary-scan port of all such circuit blocks out to the edge of the chip because this would significantly increase the number of test pins at the chip level.
Various methodologies have recently been proposed to address the difficul
Bingham & McCutchen LLP
Cadence Design Systems Inc.
Deb Anjan K.
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