Techniques for reworking circuit boards with ni/au finish

Details Techniques for reworking circuit boards with ni/au finish Techniques for reworking circuit boards with ni/au finish

2005-01-25

2005-01-25

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S764000, C029S827000, C029S839000, C029S890128, C228S180100, C228S191000, C257S666000, C439S876000

Reexamination Certificate

active

06845556

ABSTRACT:
Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying new solder to the metallic pad. Removal of the original solder and the outer portion of the metallic pad exposes the inner portion which has non-corroded and non-contaminated metal. The application of new solder to this inner portion of the pad enables wettability of the pad as well as provides a protective coating to prevent corrosion of the inner portion (e.g., oxidation, reaction with contaminants, etc.). Accordingly, circuit board abnormalities such as “Black Pad” defects can be cured.

REFERENCES:
patent: 3903581 (1975-09-01), Michel
patent: 4444559 (1984-04-01), Schink et al.
patent: 5152056 (1992-10-01), Shook
patent: 6257478 (2001-07-01), Straub
http://www.dremel.com/productdisplay/tool_template.asp?SKU=395&Color=99CCFF; #395 Variable-Speed MultiPro® Tool; Copyright 2000; 2 Pages.

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