Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2005-10-04
2009-10-06
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C257SE21492
Reexamination Certificate
active
07598179
ABSTRACT:
Techniques for removal of photolithographic films used in the manufacture of semiconductor devices are provided. A substrate support member of a first processing chamber includes at least three retractable pins capable of elevating a wafer from a surface of the substrate support member. In addition, the first processing chamber is configured to automatically maintain the substrate support member at a first temperature. The wafer is elevated from the surface of the substrate support member using the at least three retractable pins. Thermal heating of the substrate from the substrate support member is reduced. A photoresist layer of the substrate is etched away while the substrate is in an elevated position. An anti-reflective layer of the substrate can be etched to remove substantially all of the anti-reflective layer. In a specific embodiment, the anti-reflective layer includes a DUO™ Bottom Anti-Reflective Coating by Honeywell International Inc.
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Cheng Lien Huang
Wang Chao
Wang Runshun
Coleman W. David
Semiconductor Manufacturing International (Shanghai) Corporation
Townsend and Townsend / and Crew LLP
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