Techniques for providing decoupling capacitance

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Rendering selected devices operable or inoperable

Reexamination Certificate

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C257SE21575

Reexamination Certificate

active

07488624

ABSTRACT:
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

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patent: 2005/0017333 (2005-01-01), Bohr
patent: 2006/0228855 (2006-10-01), Min et al.

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