Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Rendering selected devices operable or inoperable
Reexamination Certificate
2005-08-11
2008-10-14
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Rendering selected devices operable or inoperable
C257SE21596
Reexamination Certificate
active
07435627
ABSTRACT:
Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.
REFERENCES:
patent: 4803595 (1989-02-01), Kraus et al.
patent: 5016087 (1991-05-01), Haug et al.
patent: 5162264 (1992-11-01), Haug et al.
patent: 5329237 (1994-07-01), Horch
patent: 5854534 (1998-12-01), Beilin et al.
patent: RE36087 (1999-02-01), Horch
patent: 6791133 (2004-09-01), Farooq et al.
patent: 2004/0085120 (2004-05-01), Pitts
patent: 2004/0108587 (2004-06-01), Chudzik et al.
patent: 2005/0017333 (2005-01-01), Bohr
patent: 2006/0228855 (2006-10-01), Min et al.
Horton Raymond R.
Knickerbocker John U.
Sprogis Edmund J.
Tsang Cornelia K.
Geyer Scott B
International Business Machines - Corporation
Ryan & Mason & Lewis, LLP
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