Techniques for multipoint dispensing of viscous material

Fluent material handling – with receiver or receiver coacting mea – Processes – Filling dispensers

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141 8, 141 11, 141 12, 141 82, 141 72, 141 73, B65B 108, B65B 3100

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045974209

ABSTRACT:
A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocity cycle (FIG. 3B). Also, an improved method for loading solder paste into the dispensing tool includes applying vacuum to two regions of the tool while vibrating it in its axial direction (FIG. 4). Furthermore, improved techniques for preventing crust formation on the paste within the tool, and for controlling the viscosity of the solder paste within the tool, achieve consistent dispensing results in a production environment.

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Article by D. Schoenthaler entitled "Soldering Circuit Assemblies in the 1980's" published in Proceedings of Printed Circuit World Convention II, Munich, West Germany, vol. 1, pp. 131-140, Jun. 9-12, 1981.

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