Techniques for mounting an area array package to a circuit...

Details Techniques for mounting an area array package to a circuit... Techniques for mounting an area array package to a circuit...

2006-08-29

2006-08-29

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S760000, C361S777000

Reexamination Certificate

active

07098408

ABSTRACT:
A circuit board assembly includes a printed circuit board (PCB). The PCB has a pad layout which includes a set of pads arranged in a two-dimensional array having at least two pads in a first direction and at least two pads in a second direction that is substantially perpendicular to the first direction. Each pad has (i) a central portion and (ii) multiple lobe portions integrated with the central portion and extending from the central portion of that pad. The circuit board assembly further includes a circuit board component mounted to the pad layout via a set of solder joints. The above-described pad layout (or land pattern) is well-suited for soldering to a variety of AAP devices (e.g., either a CCGA device or a BGA device).

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