Techniques for manufacturing flash-free contacts on a...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

Reexamination Certificate

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C264S272170, C264S276000

Reexamination Certificate

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06989122

ABSTRACT:
Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.

REFERENCES:
patent: 5139969 (1992-08-01), Mori
patent: 5356578 (1994-10-01), Isomura et al.
patent: 5380349 (1995-01-01), Taniguchi et al.
patent: 5663104 (1997-09-01), Fukuyama
patent: 5904505 (1999-05-01), Hotta et al.
patent: 6077472 (2000-06-01), Kataoka et al.
patent: 6261501 (2001-07-01), Miyagawa et al.

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