Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-22
2008-04-22
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S852000
Reexamination Certificate
active
11283446
ABSTRACT:
A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.
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Arumugham Vinayagam
Dang Lekhanh
Yang Zhiping
Arbes C. J
BainwoodHuang
Cisco Technology Inc.
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