Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-02-22
2005-02-22
Cuneo, Kamand (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S666000, C257S777000, C257S778000, C438S107000, C438S108000, C438S110000, C438S455000
Reexamination Certificate
active
06858468
ABSTRACT:
The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.
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Deane Peter
Liu Jia
Mazotti William Paul
Nguyen Luu Thanh
Pham Ken
Beyer Weaver & Thomas LLP
Cuneo Kamand
Mitchell James M.
National Semiconductor Corporation
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