Techniques for forming optical electronic integrated circuits ha

Details Techniques for forming optical electronic integrated circuits ha Techniques for forming optical electronic integrated circuits ha

1999-02-24

2000-04-18

Chaudhuri, Olik

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

385 14, H01L 2120

Patent

active

060514450

ABSTRACT:
An optical electronic integrated (circuit (OEIC) having optical waveguides s device interconnects. An optical waveguide is formed by depositing, in an oxygen-free atmosphere, a film of semiconductor material on a semiconductor substrate at a temperature that substantially diminishes the porosity of the film and the diffusion of material from the substrate into the film. The semiconductor film, which has an index of refraction greater than that of the substrate, is etched to form the optical waveguide on the substrate. The substrate also supports a plurality of active optical devices between which the optical waveguide extends. The substrate is preferably formed from gallium-arsenide and the waveguide from germanium. The active devices may also include these materials as well as aluminum-gallium-arsenide. When using these materials, the germanium film is deposited in an oxygen-free environment at about 100 degrees centigrade.

REFERENCES:
patent: 5801872 (1998-09-01), Tsuji

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