Techniques for fabricating a resistor on a flexible base...

Details Techniques for fabricating a resistor on a flexible base... Techniques for fabricating a resistor on a flexible base...

2007-01-02

2007-01-02

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S750000, C361S751000, C361S783000, C174S254000, C174S256000, C174S257000, C174S258000, C174S260000, C338S310000, C257S099000

Reexamination Certificate

active

10716143

ABSTRACT:
A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.

REFERENCES:
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patent: 2003/0079910 (2003-05-01), Kosowsky
patent: 05347434 (1993-12-01), None

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