Techniques for distributing current in a backplane assembly...

Details Techniques for distributing current in a backplane assembly... Techniques for distributing current in a backplane assembly...

2006-12-26

2006-12-26

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S796000, C361S800000

Reexamination Certificate

active

07154761

ABSTRACT:
A backplane assembly includes a main backplane having a first power conductor, a backplane strip having a second power conductor, and connecting members disposed between the main backplane and the backplane strip. The connecting members hold the backplane strip in a fixed position relative to the main backplane and electrically connect the first power conductor and the second power conductor. In one arrangement, the connecting members include source standoffs which extend from a source area of the main backplane to the backplane strip, and target standoffs which extend from a target area of the main backplane to the backplane strip. The source and target standoffs and the second power conductor provide a current path which increases current carrying capacity from the source area to the target area above that provided by the first power conductor alone. Thus, the backplane assembly is well-provisioned for distributing high currents to circuit boards.

REFERENCES:
patent: 6144561 (2000-11-01), Cannella et al.
patent: 6552277 (2003-04-01), Downes
patent: 6762362 (2004-07-01), Cavanaugh et al.
patent: 6773269 (2004-08-01), Downes
patent: 6795885 (2004-09-01), deBlanc et al.

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