Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Reexamination Certificate
2007-09-27
2008-11-04
Ta, Tho D (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
C361S805000, C439S065000
Reexamination Certificate
active
07445457
ABSTRACT:
A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and (ii) a non-overlapping portion which does not overlap any part of the second profile. A first connector mounts to a first side of the midplane over the first profile, and a second connector mounts to a second side of the midplane over the second profile. At least one PTH is a shared PTH which resides in both the first and second profiles and which engages a pin of the first connector and a pin of the second connector. Additionally, at least one PTH is a non-shared PTH which resides in the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins of the second connector.
REFERENCES:
patent: 5352123 (1994-10-01), Sample et al.
patent: 6778386 (2004-08-01), Garnett et al.
patent: 6869314 (2005-03-01), Garnett et al.
patent: 6890184 (2005-05-01), Doblar et al.
patent: 7068500 (2006-06-01), Beinor, Jr. et al.
patent: 7216195 (2007-05-01), Brown et al.
patent: 7240154 (2007-07-01), Frangioso et al.
patent: 7254741 (2007-08-01), Sardella et al.
patent: 7262962 (2007-08-01), McLeod et al.
patent: 7290330 (2007-11-01), Sardella et al.
patent: 7293135 (2007-11-01), Warnakulasooriya et al.
patent: 7295446 (2007-11-01), Crippen et al.
patent: 7320609 (2008-01-01), Minich et al.
patent: 7362572 (2008-04-01), Wierzbicki et al.
patent: 7386772 (2008-06-01), Kozel et al.
Frangioso, Jr. Ralph C.
Schillinger Michael L.
Wierzbicki Robert
BainwoodHuang
EMC Corporation
Ta Tho D
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