Optical waveguides – Integrated optical circuit
Reexamination Certificate
2005-12-06
2005-12-06
Lee, Diane I. (Department: 2876)
Optical waveguides
Integrated optical circuit
C385S092000, C385S094000, C257S684000
Reexamination Certificate
active
06973225
ABSTRACT:
The techniques of the present invention are directed towards setting a photonic device into a groove of a substrate, which is then attached to the chip sub-assembly in a way that the resulting optoelectronic package has a low profile and the interconnects between the photonic device and the semiconductor chip are short. The technique involves partially etching a groove in a substrate to allow for positioning of a photonic device within the groove. The photonic device is connected to the chip sub-assembly through interconnects that extend through the thickness of the substrate. The photonic devices are placed on their sides so that the active facets are perpendicular to the main axis of the chip sub-assembly. In this configuration, the optical fibers can be positioned parallel to the CSA top surface, ensuring a low module profile in the process.
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Briant John P.
Clarke Roger
Deane Peter
Mazotti William Paul
Nelson Michael R.
Beyer Weaver & Thomas LLP
Koyama Kumiko C.
Lee Diane I.
National Semiconductor Corporation
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