Techniques for attaching a heatsink to a circuit board using...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C257S719000, C165S080300, C165S185000, C361S704000

Reexamination Certificate

active

11001411

ABSTRACT:
A heatsink attachment assembly includes a first anchor, a second anchor and a heatsink clip. The first anchor is configured to insert into a first hole in a circuit board in an upward direction from an underside of the circuit board toward a topside of the circuit board. Similarly, the second anchor is configured to insert into a second hole in the circuit board in the upward direction. The heatsink clip has (i) a first end configured to fasten to the first anchor when the first anchor is inserted into the first hole in the circuit board, (ii) a second end configured to fasten to the second anchor when the second anchor is inserted into the second hole in the circuit board, and (iii) a middle section configured to provide force on a heatsink in a downward direction which is substantially opposite the upward direction.

REFERENCES:
patent: 4607685 (1986-08-01), Mitchell, Jr.
patent: 5329426 (1994-07-01), Villani
patent: 5380211 (1995-01-01), Kawaguchi et al.
patent: 5640305 (1997-06-01), Smithers
patent: 5734556 (1998-03-01), Saneinejad et al.
patent: 5764498 (1998-06-01), Sundstrom
patent: 5786989 (1998-07-01), Kawabe
patent: 5875545 (1999-03-01), DiStefano et al.
patent: 5894882 (1999-04-01), Kikuchi et al.
patent: 5896270 (1999-04-01), Tsui
patent: 5949020 (1999-09-01), Mitchell et al.
patent: 5969952 (1999-10-01), Hayashi et al.
patent: 5984692 (1999-11-01), Kumagai et al.
patent: 6061240 (2000-05-01), Butterbaugh et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6208517 (2001-03-01), Prince et al.
patent: 6219244 (2001-04-01), Chen
patent: 6222734 (2001-04-01), Bookhardt et al.
patent: 6269863 (2001-08-01), Wyler
patent: 6293331 (2001-09-01), Wang
patent: 6315038 (2001-11-01), Chiu
patent: 6353537 (2002-03-01), Egawa
patent: 6401807 (2002-06-01), Wyler et al.
patent: 6430052 (2002-08-01), Kordes et al.
patent: 6442036 (2002-08-01), Komatsu
patent: 6445588 (2002-09-01), Masterton et al.
patent: 6479758 (2002-11-01), Arima et al.
patent: 6492202 (2002-12-01), Lober et al.
patent: 6496371 (2002-12-01), Winkel et al.
patent: 6525266 (2003-02-01), Ferland et al.
patent: 6538891 (2003-03-01), He et al.
patent: 6545868 (2003-04-01), Kledzik et al.
patent: 6575783 (2003-06-01), Wu
patent: 6646881 (2003-11-01), Lai et al.
patent: 6667885 (2003-12-01), Malone et al.
patent: 6734371 (2004-05-01), Arrigotti et al.
patent: 6856511 (2005-02-01), Viernes et al.
patent: 6914780 (2005-07-01), Shanker et al.
patent: 7019976 (2006-03-01), Ahmad et al.
patent: 7102890 (2006-09-01), Lee et al.
patent: 7167370 (2007-01-01), Lee et al.
patent: 2004/0066626 (2004-04-01), Lee at al.
patent: 2005/0254217 (2005-11-01), Lo et al.
TCM Thermal Reticle 32262, Research Disclosure, Feb. 1991, No. 322, Kenneth Mason Publications Ltd., England, 1 page.
Assembled Heat Sinks Folded Assemblies, Sep. 20, 2002, http://www.aavidthermalloy.com/products/foldedfin/index.shtml, 2 pages.

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