Techniques for assembling polishing pads for silicon wafer polis

Details Techniques for assembling polishing pads for silicon wafer polis Techniques for assembling polishing pads for silicon wafer polis

1993-07-08

1995-04-04

Rose, Robert A.

Abrading

Machine

Rotary tool

451921, 451533, 451530, B24B 2902, B24B 722

Patent

active

054032288

ABSTRACT:
A technique for mounting polishing pads to a platen in chemi-mechanical polishing apparatus is disclosed. With two polishing pads, prior to assembly, a seal of material impervious to the chemical action of a polishing slurry is disposed about the perimeter of the interface between the pads. Preferably, the seal is a bead of silicon-based "gasket" material, such as General Electric silicon caulk (RTV) or Dow Corning silicon adhesive, and is disposed in a ring at a radius r' about one inch inward from the perimeter (circumference) of the pads. When the pads are assembled together, the bead squashes and (1) forms a seal, and (2) causes the periphery of the upper pad to curve upward--thereby creating a bowl-like reservoir for increasing the residence time of slurry on the face of the pad prior to overflowing the pad.

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Westech's Training Manual "Pad Replacement and Conditioning", dated Oct. 10, 1991 pp. 13 & 14.

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