Techniques for assembling electrical components with printed cir

Electricity: electrical systems and devices – Miscellaneous

Patent

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29832, 29840, H05K 334, H05K 706

Patent

active

042544483

ABSTRACT:
Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

REFERENCES:
patent: 2705346 (1955-04-01), Schlabach et al.
patent: 3577292 (1971-05-01), Obeda
patent: 4086696 (1978-05-01), Ikuta
patent: 4095334 (1978-06-01), Uchida

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