Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system
Reexamination Certificate
2006-05-10
2009-02-03
Bui, Bryan (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Mechanical measurement system
C438S936000, C257S254000
Reexamination Certificate
active
07487050
ABSTRACT:
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location. Techniques and devices for determining a misfit strain between a film and a substrate on which the film is deposited are also described.
REFERENCES:
patent: 5710631 (1998-01-01), Bou-Ghannam et al.
patent: 6031611 (2000-02-01), Rosakis et al.
patent: 6268883 (2001-07-01), Zehnder et al.
patent: 6469788 (2002-10-01), Boyd et al.
patent: 6513389 (2003-02-01), Suresh et al.
patent: 6600565 (2003-07-01), Suresh et al.
patent: 6781702 (2004-08-01), Giannakopoulos et al.
patent: 6924497 (2005-08-01), Suresh et al.
patent: 2003/0106378 (2003-06-01), Giannakopoulos et al.
patent: 2003/0190131 (2003-10-01), Barth
patent: 2004/0075825 (2004-04-01), Suresh et al.
patent: 2004/0257587 (2004-12-01), Rosakis et al.
patent: 2005/0007601 (2005-01-01), Rosakis et al.
patent: 2005/0030551 (2005-02-01), Rosakis et al.
patent: 2005/0278126 (2005-12-01), Rosakis et al.
patent: 05-335217 (1993-12-01), None
Finot, M., et al., “Large deformation and geometric instability of substrates with thin-film deposits”,J. Appl. Phys., 81(8):3457-3464, Apr. 1997.
Finot, M., et al., “Small and large deformation of thick and thin-film multi-layers: Effect of layer geometry, plasticity and compositional gradients”,J. Mech Phys. Solids, 44(5):683-721, May 1996.
Freund, L.B., “Substrate curvature due to thin film mismatch strain in the nonlinear deformation range”,J. Mech. Phys. Solids, 48(6-7):1159-1174, Jun. 2000.
Huang, Y. et al., “Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures”,Acta Mechanica Sinica, 21(4):362-370, Aug. 2005.
Huang, Y., et al., “Extension of Stoney's formula to non-uniform temperature distributions in thin film/substrate systems. The case of radial symmetry”,J. Mech. Phys. Solids, 53(11):2483-2500, Nov. 2005.
Lee, H., et al., “Full-field optical measurement of curvatures in ultra-thin-film-substrate systems in the range of geometrically nonlinear deformations”,J. Appl. Phys., 89(11):6116-6129, Jun. 2001.
Masters, C.B., et al., “Geometrically nonlinear stress-deflection relations for thin film/substrate systems”,Int. J. Eng. Sci, 31(6):915-925, Jun. 1993.
Park, T.-S., et al., “Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnect lines”,Acta Materialia, 48(12):3169-3175, Jul. 2000.
Park, T.-S., et al., “Measurement of full-field curvature and geometrical instability of thin film-substrate systems through CGS interferometry”,J. Mech. Phys. Solids, 51(11-12):2191-2211, Nov.-Dec. 2003.
Rosakis, A.J., et al., “Full field measurements of curvature using coherent gradient sensing: application to thin film characterization”,Thin Solid Films, 325(1-2):42-54, Jul. 1998.
Salamon, N.J., et al., “Bifurcation in isotropic thin film/substrate plates”,Int. J. Solids&Structures, 32(3/4):473-481, Feb. 1995.
Shen, Y.L., et al., “Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers”,J. Appl. Phys., 80(3):1388-1398, Aug. 1996.
Stoney, G.G., “The tension of metallic films deposited by electrolysis”,Proceedings of the Royal Society of London, 82(553):172-175, May 1909.
Wikström, A., et al., “Analysis of average thermal stresses in passivated metal interconnects”,J. Appl. Phys., 86(11):6088-6095, Dec. 1999.
Wikström, A., et al., “Thermoelastic analysis of periodic thin lines deposited on a substrate”,J. Mech. Phys. Solids, 47(5):1113-1130, Apr. 1999.
Huang Yonggang
Rosakis Ares J.
Bui Bryan
California Institute of Technology
Fish & Richardson P.C.
Teixeira Jonathan
LandOfFree
Techniques and devices for characterizing spatially... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Techniques and devices for characterizing spatially..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Techniques and devices for characterizing spatially... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4056354