Technique to modify wafer geometry

Details Technique to modify wafer geometry Technique to modify wafer geometry

1981-10-19

1984-01-10

Hayes, Monroe H.

Photocopying

Projection printing and copying cameras

Detailed holder for photosensitive paper

355 52, G03B 2760

Patent

active

044250380

ABSTRACT:
Means and methods are provided for controlling the geometry changes in a wafer or mask to permit patterns on the wafer to be matched with projected patterns from the mask. A sealed chamber is provided to receive the edges of the wafer or mask. Pressure is applied from a pressure source into the chamber against the edges of the wafer or mask uniformly in all directions to produce compressive strains until the desired wafer or mask geometry is obtained.

REFERENCES:
patent: 2873796 (1959-02-01), Riley
patent: 2889870 (1959-06-01), Mulbarger
patent: 3599699 (1971-08-01), Middleton

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