Technique for using solder etch resist in generation of patterns

Details Technique for using solder etch resist in generation of patterns Technique for using solder etch resist in generation of patterns

1974-11-21

1976-12-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

75166D, 106 1, 156 13, 156 18, 427 96, 427126, 427287, C23F 102

Patent

active

039986772

ABSTRACT:
A technique is described for the generation of a pattern on printed wiring boards bearing a layer of copper. The technique involves the use of a solder cream as an etch resist, the cream comprising a slurry of solder suspended in a curable resin flux. The use of the cream as an etch resist is similar to the use of either ink or solder plate for such purposes. However, the process described is far more economical than currently used techniques and provides a preferred alternative.

REFERENCES:
patent: 3476624 (1969-11-01), Hogya et al.
patent: 3644155 (1972-02-01), Hogya et al.
patent: 3684533 (1972-08-01), Conwicke

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