Technique for surface mounting electrical components to a...

Details Technique for surface mounting electrical components to a... Technique for surface mounting electrical components to a...

2005-05-24

2005-05-24

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S260000, C361S773000

Reexamination Certificate

active

06897378

ABSTRACT:
A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion and a tip portion extending away from the mounting portion. The circuit board defines a number of bores extending therein from a first surface to a second opposite surface, and the electrical component is mounted to the circuit board with the mounting portion of each of the number of electrical terminals supporting the component against the first surface of the circuit board with each of the tip portions extending into separate ones of the number of bores. The mounting portion of each of the electrical terminals is mechanically and electrically affixed to corresponding electrically conductive pads to thereby surface mount the electrical component to the circuit board. The disclosed technique is particularly advantageous for surface mounting display units.

REFERENCES:
patent: 4541034 (1985-09-01), Fanning
patent: 5446623 (1995-08-01), Kanetake
patent: 5726862 (1998-03-01), Huynh et al.
patent: 6274823 (2001-08-01), Khandros et al.
patent: 6336269 (2002-01-01), Eldridge et al.

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