Technique for producing interconnecting conductive links

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state

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438601, H01L 2182

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active

058613250

ABSTRACT:
A method for providing a conductive link between conductive materials, e.g., metals, separated by a non-conductive material, e.g., a silicon based glass material. In a preferred embodiment a single pulse of laser energy is applied to at least one of the conductive materials to produce mechanical strain therein which strain initiates a fracturing of the non-conductive material so as to provide at least one fissure therein extending between the conductive materials. The laser energy pulse further causes at least one of the conductive materials to flow in such fissure to provide a conductive link between the conductive materials.

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