Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to conductive state
Patent
1994-03-10
1999-01-19
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to conductive state
438601, H01L 2182
Patent
active
058613250
ABSTRACT:
A method for providing a conductive link between conductive materials, e.g., metals, separated by a non-conductive material, e.g., a silicon based glass material. In a preferred embodiment a single pulse of laser energy is applied to at least one of the conductive materials to produce mechanical strain therein which strain initiates a fracturing of the non-conductive material so as to provide at least one fissure therein extending between the conductive materials. The laser energy pulse further causes at least one of the conductive materials to flow in such fissure to provide a conductive link between the conductive materials.
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Massachusetts Institute of Technology
Picardat Kevin M.
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