Technique for mounting a semiconductor die

Details Technique for mounting a semiconductor die Technique for mounting a semiconductor die

1995-12-08

1999-03-30

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438109, 438120, 438612, 438688, H01L 2158, H01L 21603, H01L 21607

Patent

active

058888470

ABSTRACT:
A semiconductor die is mounted to a die receiving area, which is defined by inner ends of conductive leads to which the die is connected. The die is temporarily retained in a substantially fixed position relative to the die receiving area by various techniques for the purpose of permitting bond wires to be attached between the conductive leads and the die. Preferred techniques include employing a mechanical chuck, dispensing an adhesive between the die and its die receiving area, and forming an ultrasonic bond between the die and the die receiving area. Once electrical connections between the die and the conductive lines are formed, the die need not be retained in a fixed position, as the electrical connections will provide sufficient support for the die. Accordingly, conventional die attach techniques, which expose the semiconductor die to substantially elevated temperatures, are avoided. Further, dies so mounted, which are not firmly anchored in accordance with conventional the attach techniques, are not subjected to mechanical stresses resulting from a difference in die thermal expansion between the die and its die receiving area.

REFERENCES:
patent: 3793714 (1974-02-01), Bylander
patent: 3956821 (1976-05-01), Martin
patent: 5620928 (1997-04-01), Lee et al.
patent: 5642055 (1997-06-01), Difrancesco
patent: 5660319 (1997-08-01), Falcone et al.
patent: 5665473 (1997-09-01), Okoshi et al.

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