Technique for making asymmetric thyristors

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148189, 148190, H01L 21225

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active

042643830

ABSTRACT:
A method for doping a wafer of n-type seimiconductor material having two surfaces includes the steps of applying a boron solution to a first surface of the wafer and heating the wafer to drive the boron into the semiconductor wafer for forming a first p-type region. Both surfaces of the wafer are then exposed to a gallium vapor for forming a second p-type region on the second surface and deepening the extent of the first p-type region.

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patent: 3573116 (1971-03-01), Cohen
patent: 3649387 (1972-03-01), Frentz et al.
patent: 3870576 (1975-03-01), Isitorsky et al.
patent: 4038111 (1977-07-01), Dumas

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