Technique for laminating multiple substrates

Details Technique for laminating multiple substrates Technique for laminating multiple substrates

2007-09-25

2009-02-17

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S840000, C228S180100, C228S180210, C228S180220, C257S678000

Reexamination Certificate

active

07490402

ABSTRACT:
The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

REFERENCES:
patent: 5046238 (1991-09-01), Diagle et al.
patent: 5276955 (1994-01-01), Noddin et al.
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5489804 (1996-02-01), Pasch
patent: 5615477 (1997-04-01), Sweitzer
patent: 5786238 (1998-07-01), Pai et al.
patent: 5953816 (1999-09-01), Pai et al.
patent: 5977490 (1999-11-01), Kawakita et al.
patent: 5986339 (1999-11-01), Pai et al.
patent: 6139777 (2000-10-01), Omoya et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6573460 (2003-06-01), Roeters et al.
patent: 6742247 (2004-06-01), Pai et al.
patent: 6856008 (2005-02-01), Pai et al.
patent: 6884313 (2005-04-01), Liu et al.
patent: 10-190225 (1998-07-01), None
patent: WO 9836624 (1998-08-01), None
Deepak K. Pai, “An Approach to Fabricate High Density, Large-Layer-Count PWB,” presented at the Printed Circuits Expo 2000, Apr. 2-6, 2000, San Diego, California, pp. S09-2-1 to S09-2-4.
Deepak K. Pai, “An Approach to Fabricate High Density, Large-Layer-County PWB,” Design Technical Journal, vol. 2, No. 2, Spring/Summer 2000, pp. 16-18.
Deepak K. Pai, “An Approach to Fabricate High Density, Large-Layer-County PWB,” Surface Mount Technology Association (SMTA) International Proceedings 2001, Sep. 30-Oct. 4, 2001, pp. 569-579.
International Search Report for Application No. PCT/US03/07842 dated Sep. 23, 2003.

Affiliated with

Also associated with

Rating

Technique for laminating multiple substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Technique for laminating multiple substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Technique for laminating multiple substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4090561